Method of dicing thin semiconductor substrates
AssigneeAsm Technology Singapore Pte Ltd
InventorsKarel Maykel Richard Van Der Stam, Guido Martinus Henricus Knippels, Mark Christian Mueller, Juergen Roland Betz
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Abstract
A method of dicing a plurality of integrated devices included in a semiconductor substrate using laser energy comprises the steps of directing a first laser beam onto a cutting line along the substrate to ablate a portion of the substrate located along the cutting line to be diced, the portion of the substrate that is ablated forming a recast material adjacent to the cutting line of the substrate that has been diced. A second laser beam is directed onto another portion of the substrate adjacent to the cutting line to conduct heat processing of the recast material formed adjacent to the cutting line.
Claims15
Method of dicing a plurality of integrated devices included in a semiconductor substrate using laser energy, the method comprising the steps of:
- directing a first laser beam onto a cutting line along the substrate to ablate a portion of the substrate located along the cutting line to be diced, the portion of the substrate that is ablated forming a recast material adjacent to the cutting line of the substrate that has been diced;
- and
- directing a second laser beam onto another portion of the substrate adjacent to the cutting line to conduct heat processing of the recast material formed adjacent to the cutting line.
Dependencies are inferred from the claim text.