Screen print mask for laser scribe and plasma etch wafer dicing process

A method of dicing a semiconductor wafer comprising a plurality of integrated circuits separated by streets, the method comprising:

• screen-printing a blanket masking layer above the semiconductor wafer, the blanket masking covering the integrated circuits and the streets of the semiconductor wafer, wherein the blanket masking layer is a sacrificial blanking masking layer;
• laser ablating portions of the blanket masking layer and the streets with a laser scribing process to provide a patterned mask and to expose regions of the semiconductor wafer between the integrated circuits;
• and
• plasma etching the semiconductor wafer through the exposed regions of the semiconductor wafer to singulate the integrated circuits, wherein the patterned mask protects the integrated circuits during the plasma etching.

A system for dicing a semiconductor wafer comprising a plurality of integrated circuits, the system comprising:

• a factory interface;
• a screen print processing system coupled with the factory interface;
• a laser scribe apparatus coupled with the factory interface;
• and a plasma etch chamber coupled with the factory interface wherein the screen print processing system is configured for screen printing a patterned mask, the screen print processing system comprising one or more cameras for aligning a screen with a semiconductor wafer.