Removing conductive material to form conductive features in a substrate

A method, comprising:

• forming a hole in a substrate, wherein the hole includes a first side feature on an outer edge of the hole, and wherein the first side feature traverses a vertical dimension of the hole;
• subsequent to forming the hole in the substrate, depositing conductive material into the hole such that the first side feature is substantially filled with the conductive material;
• and
• removing a part of the conductive material that occupies a first lengthwise portion of the hole, such that at least one conductive feature that occupies a second lengthwise portion of the hole remains in the substrate, wherein the at least one conductive feature is disposed at least partially within the first side feature, wherein the hole includes a plurality of side features on the outer edge of the hole, wherein each of the plurality of side features traverses the vertical dimension of the hole, wherein the plurality of side features includes the first side feature, and wherein the removing the part of the conductive material comprises
• removing the part of the conductive material such that a plurality of conductive features are correspondingly disposed at least partially in the plurality of side features,
• wherein a distance between a first conductive feature of the plurality of conductive features and a second conductive feature of the plurality of conductive features is less than 20 μm.

A method, comprising:

• forming a hole in a substrate, wherein the hole includes a first side feature on an outer edge of the hole, and wherein the first side feature traverses a vertical dimension of the hole;
• subsequent to forming the hole in the substrate, depositing conductive material into the hole such that the first side feature is substantially filled with the conductive material;
• and
• removing a part of the conductive material that occupies a first lengthwise portion of the hole, such that at least one conductive feature that occupies a second lengthwise portion of the hole remains in the substrate, wherein the at least one conductive feature is disposed at least partially within the first side feature,
• wherein a widest lateral portion of the at least one conductive feature is less than 20 μm.

A method, comprising:

• forming a hole in a substrate, wherein the hole includes a first side feature and a second side feature on an outer edge of the hole, wherein the first side feature and the second side feature traverse a vertical dimension of the hole;
• subsequent to forming the hole in the substrate, depositing conductive material into the hole such that (i) a first portion of the conductive material is deposited in the first side feature, (ii) a second portion of the conductive material is deposited in the second side feature, (iii) a third portion of the conductive material is deposited in the hole, the third portion of the conductive material not being deposited in either the first side feature or the second side feature, and (iv) the first portion, the second portion and the third portion form a contagious section of the conductive material deposited in the hole;
• and
• removing a part of the conductive material that occupies a first lengthwise portion of the hole, such that at least a first conductive feature and a second conductive feature remains in the substrate, wherein the first conductive feature occupies a second lengthwise portion of the hole, wherein the second conductive feature occupies a third lengthwise portion of the hole, wherein the first conductive feature is disposed at least partially within the first side feature, and wherein the second conductive feature is disposed at least partially within the second side feature.