Interconnection of several levels of a stack of supports for electronic components

Method for producing a microelectronic device comprising steps of:

• providing an assembly of stacked supports including a first support and a second support on the first support, each support provided with one or more electronic components, and forming a stack having a front face;
• forming a plurality of blind holes through the front face of the stack, including at least one first blind hole passing only through said first support, and at least one second blind hole passing through said first support and through said second support;
• after forming the blind holes forming a masking on said front face of the stack, the masking comprising at least one opening revealing the first blind hole, the second blind hole and a region of the front face of the stack that extends from the first blind hole to the second blind hole;
• and
• after forming the masking, depositing conductive material simultaneously in the first blind hole, the second blind hole and on the region of the front face, so as to form a conductive structure comprising a first conductive element covering the bottom of the first blind hole and a second conductive element covering the bottom of the second blind hole, said first and second conductive elements being connected together by a conductive portion disposed on said region of the front face.