US 9,312,160 B2 · Wafer suction method, wafer suction stage, and wafer suction system

Abstract

A method of attaching a wafer by suction, includes a step of mounting a wafer on a right arm and a left arm of a transfer jig, moving the transfer jig toward a wafer suction stage in such a manner that a facing right arm surface of the right arm slides along and in contact with a first side surface of the wafer suction stage and a facing left arm surface of the left arm slides along and in contact with a second side surface of the wafer suction stage until the wafer comes to lie directly above a mounting surface of the wafer suction stage, mounting the wafer on the mounting surface by moving the transfer jig downward toward the wafer suction stage while maintaining the contacts, and attaching the wafer to the mounting surface by suction.

Claims9

Dependent claims

A wafer suction stage having a space therein, comprising:

a mounting surface for mounting a wafer thereon;
a porous section formed in a passage of said wafer suction stage and having a top surface exposed at said mounting surface and a bottom surface adjoining said space;
and
a connection path communicating with said space and extending to an outside of said wafer suction stage;
wherein said porous section is formed to decrease in thickness with increasing distance from said connection path, and
wherein the thickness is measured in a direction perpendicular to the mounting surface.

3 more elements

Dependencies are inferred from the claim text.

Wafer suction method, wafer suction stage, and wafer suction system

Life of this patent

Wafer suction method, wafer suction stage, and wafer suction system

Life of this patent

Abstract

Claims9