Method of manufacturing semiconductor device and method of manufacturing electronic device including an adhesive layer on a support member
AssigneeFujitsu Limited
InventorsShinya Sasaki, Yoshikatsu Ishizuki, Motoaki Tani
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a semiconductor device, includes: providing a first adhesive layer on a support member; providing a film on the first adhesive layer; arranging a semiconductor element on the film; providing a resin layer on the film on which the semiconductor element is arranged, and forming a substrate including the semiconductor element and the resin layer on the film; and separating the film and the substrate from the first adhesive layer.
Claims14
A method of manufacturing a semiconductor device comprising:
- providing a first adhesive layer on a support member;
- providing a film on the first adhesive layer;
- arranging a semiconductor element on the film;
- providing a resin layer on the film on which the semiconductor element is arranged, and forming a substrate including the semiconductor element and the resin layer on the film;
- separating the film and the substrate from the first adhesive layer;
- and
- separating the film from the substrate after the substrate and the film have been simultaneously separated from the first adhesive layer.
A method of manufacturing a semiconductor device comprising:
- providing a first adhesive layer on a support member;
- providing a first film on the first adhesive layer;
- arranging a first semiconductor element on the first film;
- providing a first resin layer on the first film on which the first semiconductor element is arranged and forming a first substrate including the first semiconductor element and the first resin layer on the first film;
- simultaneously separating the first film and the first substrate from the first adhesive layer;
- providing a second film on the first adhesive layer from which the first substrate and the first film have been separated;
- arranging a second semiconductor element on the second film;
- providing a second resin layer on the second film on which the second semiconductor element is arranged and forming a second substrate including the second semiconductor element and the second resin layer on the second film;
- and
- simultaneously separating the second film and the second substrate from the first adhesive layer.
A method of manufacturing an electronic device comprising:
- providing an adhesive layer on a support member;
- providing a film on the adhesive layer;
- arranging a semiconductor element on the film;
- providing a resin layer on the film on which the semiconductor element is arranged and forming a substrate including the semiconductor element and the resin layer on the film;
- simultaneously separating the film and the substrate from the adhesive layer;
- separating the film from the substrate after the substrate and the film have been simultaneously separated from the adhesive layer;
- providing a wiring layer on a surface of the substrate from which the film has been separated, the wiring layer including a conductive part to be electrically connected to the semiconductor element;
- cutting the resin layer and the wiring layer at a position around the semiconductor element to obtain a semiconductor package that includes the semiconductor element, the resin layer, and the wiring layer;
- and
- mounting the semiconductor package to a circuit board.
Dependencies are inferred from the claim text.