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US 9,312,149 B2Granted
Method for forming chip-on-wafer assembly
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Cheng-Lin Huang, Szu Wei Lu, Jui-Pin Hung, Shin-Puu Jeng, Chen-Hua Yu
Life of this patent
Estimating the term…
Abstract
A device includes a bottom chip and an active top die bonded to the bottom chip. A dummy die is attached to the bottom chip. The dummy die is electrically insulated from the bottom chip.
Claims20
A method comprising:
- bonding a plurality of active dies to a wafer, wherein each of the plurality of active dies is bonded to one of a plurality of chips in the wafer through electrical connectors;
- attaching a plurality of dummy dies to the plurality of chips, wherein each of the plurality of dummy dies is attached to one of the plurality of chips through one of a plurality of die-attach films, with each of the plurality of die-attach films in physical contact with both a respective one of the dummy dies and a respective one of the plurality of chips, and the plurality of dummy dies is electrically insulated from the plurality of chips by the plurality of die-attach films;
- and
- filling a molding compound into gaps between the plurality of active dies and the plurality of dummy dies.
1 more element
A method comprising:
- attaching a plurality of dummy dies to a plurality of chips of a wafer;
- molding the plurality of dummy dies in a molding compound;
- thinning the molding compound to expose the plurality of dummy dies;
- and
- sawing the wafer into a plurality of packages, with each of the plurality of packages comprising one of the plurality of dummy dies.
2 more elements
A method comprising:
- attaching a first plurality of dummy dies to a plurality of chips of a wafer;
- bonding a plurality of active dies to the plurality of chips;
- attaching a second plurality of dummy dies to a plurality of incomplete chips of the wafer;
- and
- molding the first plurality of dummy dies, the second plurality of dummy dies, and the plurality of active dies in a molding compound, wherein no active die is bonded to the plurality of incomplete chips when the molding is performed.
2 more elements
Dependencies are inferred from the claim text.