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US 9,312,142 B2Granted
Chemical mechanical polishing method and apparatus
AssigneeGlobalfoundries Inc.
InventorJens Kramer
Life of this patent
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Abstract
Methods for polishing a semiconductor wafer using a pad resurfacing arm and an apparatus therefor are disclosed. Embodiments may include providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool including a polish pad and a pad resurfacing arm which includes a pad cleaning part, a pad conditioning part, and a slurry dispensing part, dispensing a slurry to the polish pad utilizing the pad resurfacing arm, and polishing the semiconductor wafer utilizing the polish pad.
Claims8
A method comprising:
- providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool comprising:
- a polish pad, and
- a pad resurfacing arm having a cylindrical or conical shape with a length extending from an outer periphery of the polish pad and across a center of the polish pad, the pad resurfacing arm comprising:
- a pad cleaning part,
- a pad conditioning part, and
- a slurry dispensing part;
- dispensing a slurry to the polish pad utilizing the pad resurfacing arm;
- and
- polishing the semiconductor wafer utilizing the polish pad by rotating the pad resurfacing arm.
6 more elements
A method comprising:
- providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool comprising:
- a polish pad, and
- a cylindrical pad resurfacing arm comprising guides of a plastic material and having a length extending from an outer periphery of the polish pad and across a center of the polish pad, the pad resurfacing arm further comprising:
- a pad cleaning part,
- a pad conditioning part, and
- a slurry dispensing part;
- cleaning the polish pad, utilizing the pad resurfacing arm;
- conditioning the polish pad, utilizing the pad resurfacing arm;
- dispensing a slurry to the polish pad, utilizing the pad resurfacing arm;
- and
- polishing the semiconductor wafer, utilizing the polish pad,
- wherein utilizing the pad resurfacing arm comprises:
- vertically rotating the pad resurfacing arm,
- sliding the pad resurfacing arm on the polish pad, and
- applying different levels of force to the polish pad from different locations of the pad resurfacing arm.
12 more elements
Dependencies are inferred from the claim text.