Method of manufacturing semiconductor devices including generating and annealing radiation-induced crystal defects
AssigneeInfineon Technologies AG
InventorsJohannes Georg Laven, Hans-Joachim Schulze, Moriz Jelinek, Werner Schustereder
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Abstract
The generation of auxiliary crystal defects is induced in a semiconductor substrate. Then the semiconductor substrate is pre-annealed at a temperature above a dissociation temperature at which the auxiliary crystal defects transform into defect complexes, which may be electrically inactive. Then protons may be implanted into the semiconductor substrate to induce the generation of radiation-induced main crystal defects. The defect complexes may enhance the efficiency of the formation of particle-related dopants based on the radiation-induced main crystal defects.
Claims16
A method of manufacturing a semiconductor device, the method comprising:
- inducing generation of auxiliary crystal defects in a semiconductor substrate;
- then
- pre-annealing the semiconductor substrate at a temperature above a dissociation temperature at which the auxiliary crystal defects transform into crystal defect complexes;
- and then
- implanting main implant protons into the semiconductor substrate, wherein implanting the main implant protons induces a generation of radiation-induced main crystal defects.
Dependencies are inferred from the claim text.