Self-aligned dynamic pattern generator device and method of fabrication

A method of fabricating a self-aligning dynamic pattern generator device for modulating at least one electron beam used for electron-beam imaging or direct-write lithography, the method comprising:

• providing a substrate with a plurality of microelectronics devices fabricated in the substrate,
• performing at least one lithographic and etching step on a top layer of the substrate to form vias through at least one passivation layer on the surface of the substrate, at locations of each of an array of pixels to be formed in the device, to a plurality of electrically conductive layers under the at least one passivation layer interconnecting the microelectronics devices fabricated in the substrate,
• depositing a plurality of first highly electrically conductive layers into the vias to make electrical contact with the plurality of the electrically conductive layers interconnecting the plurality of microelectronics devices fabricated in the substrate,
• depositing a plurality of second contact highly electrically conductive layers on the first highly electrically conductive layers filling the vias, and selectively performing a second lithographic and etching step on the plurality of second highly electrically conductive layers to form a plurality of bottom electrode layers corresponding to the array of pixels to be formed in the device,
• depositing onto the plurality of bottom highly electrically conductive electrode layers a high resistivity material intermediate layer to form a continuous blanket layer to coat the substrate surface,
• depositing as a continuous layer without lithography and etching a third highly electrically conductive layer on the high resistivity material intermediate layer to form a first device electrode layer,
• subsequently depositing a predetermined number of times as continuous layers without lithography and etching additional high resistivity material intermediate layers, followed by additional deposition of a highly electrically conductive layers to obtain a predetermined number of highly electrically conductive and high resistivity material layers forming a stack of alternating high resistivity material and highly electrically conductive layers as part of the device's structure,
• subsequently after the last and topmost additional highly electrically conductive layer is deposited, performing a third lithographic and etching step on the topmost additional highly electrically conductive layer to form a plurality of circular openings corresponding to the locations of each of the pixels in the array of pixels to be formed in the device,
• subsequently performing at least one reactive ion etch so as to etch through each of the stack of alternating high resistivity material and highly electrically conductive layers or the entire stack of alternating high resistivity material and highly electrically conductive layers, except the bottom highly electrically conductive electrode layers to form a plurality of cylindrical trenches, with each trench being at a location corresponding to a location of one of the pixels in the array of pixels to be formed in the device,
• wherein the number of pixels forming the array of pixels in the device determines a number of electron beams that can be modulated by the fabricated dynamic pattern generator device and thereby a rate of electron-beam imaging or direct writing rate of the fabricated dynamic pattern generator device,
• wherein the highly electrically conducting layers are a metal, a conductive semiconductor material or an electrically conductive ceramic material,
• wherein the high resistivity material is silicon or germanium, and
• wherein the intermediate high resistivity material layers in the stack of alternating high resistivity material and highly electrically conductive layers eliminate a need for a charge dissipating coating on interior surfaces of the pixels in the device to prevent a build-up of electrical charge from incoming electrons on insulating surfaces in the pixels.

A method of fabricating a self-aligning dynamic pattern generator device for modulating at least one electron beam used for electron-beam imaging or direct-write lithography, the method comprising:

• providing a substrate,
• depositing a first highly electrically conductive layer onto the substrate,
• performing at least one lithographic and etching step on the first highly electrically conductive layer to pattern and etch the first highly electrically conductive layer into a shape of a plurality of bottom electrodes corresponding to an array of pixels to be formed in the device,
• depositing onto the plurality of bottom highly electrically conductive electrode layers a weakly electrically conductive intermediate layer to form a continuous blanket layer to coat the substrate surface,
• depositing as a continuous layer without lithography and etching a third highly electrically conductive layer on the weakly electrically conductive intermediate layer to form a first device electrode layer,
• subsequently depositing a predetermined number of times as continuous layers without lithography and etching an additional weakly electrically conductive intermediate layer, followed by an additional highly electrically conductive deposition layer to obtain a predetermined number of highly electrically conductive and weakly electrically conductive layers forming a stack of alternating weakly electrically conductive and highly electrically conductive layers as part of the device's structure,
• subsequently after the last and topmost additional highly electrically conductive layer is deposited, performing a lithographic and etching step on the topmost additional highly electrically conductive layer to form a plurality of circular openings corresponding to the locations of each of the pixels in the array of pixels to be formed in the device,
• subsequently performing at least one Inductively-Coupled Plasma (ICP) etch so as to etch through each of the stack of alternating weakly electrically conductive and highly electrically conductive layers or the entire stack of alternating weakly electrically conductive and highly electrically conductive layers, except the bottom highly electrically conductive electrode layers to form a plurality of cylindrical trenches, with each trench being at a location corresponding to a location of one of the pixels in the array of pixels to be formed in the device, and wherein the number of pixels forming the array of pixels in the device determines a number of electron beams that can be modulated by the fabricated dynamic pattern generator device and thereby a rate of electron-beam imaging or direct writing rate of the fabricated dynamic pattern generator device,
• wherein the highly electrically conducting layers are a metal, a conductive semiconductor material or an electrically conductive ceramic material, and
• wherein the weakly electrically conducting layers are a dielectric material or an insulator material.

A method of fabricating a self-aligning dynamic pattern generator device for modulating at least one electron beam used for electron-beam imaging or direct-write lithography, the method comprising:

• providing a substrate,
• depositing a first highly electrically conductive layer onto the substrate,
• performing at least one lithographic and etching step on the first highly electrically conductive layer to pattern and etch the first highly electrically conductive layer into a shape of a plurality of bottom electrodes corresponding to an array of pixels to be formed in the device,
• depositing onto the plurality of bottom highly electrically conductive electrode layers a high resistivity material intermediate layer to form a continuous blanket layer to coat the substrate surface,
• depositing as a continuous layer without lithography and etching a third highly electrically conductive layer on the high resistivity material intermediate layer to form a first device electrode layer,
• subsequently depositing a predetermined number of times as continuous layers without lithography and etching an additional high resistivity material intermediate layer, followed by an additional highly electrically conductive deposition layer to obtain a predetermined number of highly electrically conductive and high resistivity material layers forming a stack of alternating high resistivity material and highly electrically conductive layers as part of the device's structure,
• subsequently after the last and topmost additional highly electrically conductive layer is deposited, performing a lithographic and etching step on the topmost additional highly electrically conductive layer to form a plurality of circular openings corresponding to the locations of each of the pixels in the array of pixels to be formed in the device,
• subsequently performing at least one Inductively-Coupled Plasma (ICP) etch so as to etch through each of the stack of alternating high resistivity material and highly electrically conductive layers or the entire stack of alternating high resistivity material and highly electrically conductive layers, except the bottom highly electrically conductive electrode layers to form a plurality of cylindrical trenches, with each trench being at a location corresponding to a location of one of the pixels in the array of pixels to be formed in the device, and
• wherein the number of pixels forming the array of pixels in the device determines a number of electron beams that can be modulated by the fabricated dynamic pattern generator device and thereby a rate of electron-beam imaging or direct writing rate of the fabricated dynamic pattern generator device,
• wherein the highly electrically conducting layers are a metal, a conductive semiconductor material or an electrically conductive ceramic material,
• wherein the high resistivity material is silicon or germanium, and
• wherein the intermediate high resistivity material layers in the stack of alternating high resistivity material and highly electrically conductive layers eliminate a need for a charge dissipating coating on interior surfaces of the pixels in the device to prevent a build-up of electrical charge from incoming electrons on insulating surfaces in the pixels.