Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same

A method of manufacturing a winding-type solid electrolytic capacitor package structure using a carrier board, comprising:

• providing a carrier body;
• placing a plurality of winding capacitors on the carrier body, wherein each winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body, the positive conductive lead pin of each winding capacitor has a positive end surface, and the negative conductive lead pin of each winding capacitor has a negative end surface;
• forming a package material on the carrier body to enclose the winding capacitors;
• cutting the carrier body and the package material to separate the winding capacitors from each other, wherein the carrier body is cut into a plurality of substrate bodies for respectively carrying the winding capacitors, the package material is cut into a plurality of package bodies to respectively enclose the winding bodies of the winding capacitors, and each package body has a first lateral surface substantially flushed with the positive end surface of the corresponding winding capacitor and a second lateral surface opposite to the first lateral surface and substantially flushed with the negative end surface of the corresponding winding capacitor;
• and
• forming a positive electrode structure to cover the first lateral surface of the package body and electrically contact the positive end surface of the positive conductive lead pin and forming a negative electrode structure to cover the second lateral surface of the package body and electrically contact the negative end surface of the negative conductive lead pin.