Inspection method and device therefor
AssigneeHitachi High-Technologies Corporation
InventorsMinoru Harada, Ryo Nakagaki, Takehiro Hirai, Naoki Hosoya
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AssigneeHitachi High-Technologies Corporation
InventorsMinoru Harada, Ryo Nakagaki, Takehiro Hirai, Naoki Hosoya
Estimating the term…
Disclosed is a method of inspecting an object to be inspected in a semiconductor manufacturing process, for resolving the problem to increase defect detection sensitivity. An image capture means is used to image capture a designated area of the object to be inspected; a defect is detected in the captured image; a circuit pattern is recognized from the captured image; a characteristic value is computed, relating to an image tone and shape, from the detected defect; a characteristic value is computed, relating to the image tone and shape, from the recognized circuit pattern; either a specified defect or circuit pattern is filtered and extracted from the detected defect and the recognized circuit pattern; a mapping characteristic value is determined from the characteristic value of either the filtered and extracted specified defect or circuit pattern; and the distribution of the determined characteristic values is displayed onscreen in a map format.
An inspection method for inspecting an inspection target, the method comprising:
A device for inspecting an inspection target, comprising:
An inspection method for inspecting an inspection target, the method comprising:
A device for inspecting an inspection target, comprising:
Dependencies are inferred from the claim text.