Photocurable/thermosetting resin composition
AssigneeTaiyo Ink Mfg. Co., Ltd.
InventorsNobuhito Ito, Masao Arima
Life of this patent
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Abstract
Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.
Claims20
An alkali-developable photocurable/thermosetting resin composition, comprising:
- a carboxyl group-containing photosensitive resin;
- a photopolymerization initiator;
- a block copolymer;
- and
- a thermosetting component,
- wherein the carboxyl group-containing photosensitive resin is obtained from a starting material without an epoxy resin, and
- the block copolymer is represented by Formula (I):
- A-B-A (I),
- where each A individually represents a polymer unit having a glass transition temperature, Tg, of 0° C. or higher, and B represents a polymer unit having a glass transition temperature, Tg, of lower than 0° C.
Dependencies are inferred from the claim text.