Optical connection techniques and configurations
AssigneeIntel Corporation
InventorsHenning Braunisch, Shawna M. Liff, Peter L. Chang
Life of this patent
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Abstract
Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed.
Claims13
A system comprising:
- a package substrate having a surface upon which a processor is mounted;
- an optoelectronic assembly electrically coupled with the package substrate and the processor, the optoelectronic assembly having one or more optical apertures that emit and/or receive the light in a direction that is substantially perpendicular to the surface of the package substrate;
- and
- a receptacle mounted on the package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with the one or more optical apertures of the optoelectronic assembly when the optical coupler plug is plugged into the pluggable surface of the receptacle, wherein the receptacle includes an electrically insulative material and is attached to the package substrate using one or more dummy interconnect structures.
An apparatus comprising:
- a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate, wherein the receptacle includes an electrically insulative material and is to attach to the package substrate using one or more dummy interconnect structures.
Dependencies are inferred from the claim text.