Probe member for pogo pin
AssigneeIsc Co., Ltd.
InventorJae-Hak Lee
Life of this patent
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Abstract
Provided is probe member for a pogo pin used for testing a semiconductor device, at least a portion of the probe member being inserted into a cylindrical body and supported by an elastic member and an upper end of the probe member contacting a terminal of the semiconductor device.
Claims10
A probe member for a pogo pin used for testing a semiconductor device, with a first end and at least part of a middle portion of the probe member telescopically cooperating with a cylindrical body and supported by an elastic member, and an upper second end of the probe member for contacting a terminal of the semiconductor device to be tested, the probe member comprising:
- an elongate body having a first end, a spaced apart second end and a middle portion aligned along an common axis;
- wherein the upper second end of the elongate body is provided with a plurality of first projections adjacent the axis for contacting the terminal of the semiconductor device to be tested and a plurality of second projections located radially outboard of the first projections and spaced about the axis;
- and
- wherein the plurality of first projections provide contact with the terminal of the semiconductor device during testing and the second projections have an inwardly sloped guide surfaces to guide the terminal of the semiconductor device toward the first projections during installation.
A probe member for a pogo pin used for testing a semiconductor device, at least a portion of the probe member being inserted into a cylindrical body and an upper end of the probe member contacting a terminal of the semiconductor device, the probe member comprising:
- a probe portion, in an upper end of which a plurality of probes contacting the terminal of the semiconductor device are formed;
- and
- a combining portion that extends downwards from the probe portion and is inserted into the cylindrical body to be combined with the cylindrical body,
- wherein the probes comprise a plurality of first probes arranged at an upper center of the probe portion and contacting the terminal of the semiconductor device and a second probe arranged in an upper edge of the probe portion and having a protrusion height that is greater than a protrusion height of the first probes.
Dependencies are inferred from the claim text.