Matrix thermal sensing circuit and heat dissipation system

A heat-dissipation system used in an electronic device, wherein the electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board, comprising:

• a matrix thermal sensing circuit, including:
• a current sensing module including a plurality of sensing nodes, wherein each sensing node is electrically connected to a current feeding terminal of one corresponding load element and senses the working current of the corresponding load element;
• and
• a calculation module connected to the current sensing module and used to determine the thermal state of the location of each of the sensing nodes according to the corresponding working current;
• a fan module;
• and
• a fan control circuit electrically connected to the calculation module and the fan module,
• wherein the circuit board is divided into N first segments along a first direction and M second segments along a second direction perpendicular to the first direction to form a matrix of M*N blocks, where M and N are integers greater than zero, each of the load elements being disposed on the circuit board in one of the blocks;
• wherein the fan module comprises a plurality of first fan units disposed at different positions around the circuit board along the first direction, and a plurality of second fan units disposed at different positions around the circuit board along the second direction, each of the first fan units being aligned in the second direction to a row of blocks of the circuit board, and each of the second fan units being aligned in the first direction to a column of blocks of the circuit board;
• wherein when the calculation module determines that one of the sensing nodes overheats, the fan control circuit controls one of the first fan units and one of the second an units in the second direction and in the first direction, respectively with the block in which the load corresponding to said one of the sensing nodes is located.