Measuring device for measuring distance

A method for adjusting a measuring device, wherein the measuring device comprises:

• a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;
• a beam-shaping optical element;
• a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element;
• a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, and a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the beam-splitting optical element is mounted in the third receptacle;
• wherein the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element;
• a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle;
• and
• a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;
• and comprising the steps of:
• adjusting the first electro-optical component and the beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the first electro-optical component and the beam-shaping optical element;
• abutting the printed circuit board against the monolithic optics carrier;
• and
• adjusting the second electro-optical component only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

A measuring device for measuring a distance between a reference mark and a target object, comprising:

• a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;
• a beam-shaping optical element;
• a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element;
• a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, and a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and wherein the beam-splitting optical element is an aperture mirror and is integrated into the monolithic optics carrier;
• a printed circuit board including a third receptacle, wherein the second electro-optical component is mounted in the third receptacle;
• and
• a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;
• wherein, during an adjustment of the measuring device, the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element, and the second electro-optical component is adjustable and fixable only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component, such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

A method for adjusting a measuring device, wherein the measuring device comprises:

• a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;
• a beam-shaping optical element;
• a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element;
• a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, and a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and wherein the beam-splitting optical element is an aperture mirror and is integrated into the monolithic optics carrier;
• wherein the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element;
• a printed circuit board including a third receptacle, wherein the second electro-optical component is mounted in the third receptacle;
• and
• a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;
• and comprising the steps of:
• adjusting the first electro-optical component and the beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the first electro-optical component and the beam-shaping optical element;
• abutting the printed circuit board against the monolithic optics carrier;
• and
• adjusting the second electro-optical component only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

A measuring device for measuring a distance between a reference mark and a target object, comprising:

• a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;
• a first beam-shaping optical element and a second beam-shaping optical element which differs from the first beam-shaping optical element, wherein the first and second beam-shaping optical elements shape the laser beam and the reception beam;
• a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, a second receptacle, wherein the first beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the second beam-shaping optical element is mounted in the third receptacle;
• a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle;
• and
• a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;
• wherein, during an adjustment of the measuring device, the first electro-optical component and/or the first beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and/or the first beam-shaping optical element, the second beam-shaping optical element is only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the second beam-shaping optical element, and the second electro-optical component is adjustable and fixable only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component, such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

A method for adjusting a measuring device, wherein the measuring device comprises:

• a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;
• a first beam-shaping optical element and a second beam-shaping optical element which differs from the first beam-shaping optical element, wherein the first and second beam-shaping optical elements shape the laser beam and the reception beam;
• a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, a second receptacle, wherein the first beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the second beam-shaping optical element is mounted in the third receptacle;
• wherein the first electro-optical component and/or the first beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and/or the first beam-shaping optical element and wherein the second beam-shaping optical element is only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the second beam-shaping optical element;
• a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle;
• and
• a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;
• and comprising the steps of:
• adjusting the first electro-optical component and/or the first beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the first electro-optical component and/or the first beam-shaping optical element;
• adjusting the second beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the second beam-shaping optical element;
• abutting the printed circuit board against the monolithic optics carrier;
• and
• adjusting the second electro-optical component only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.