Light-emitting device and method of manufacturing the same
AssigneeToyoda Gosei Co., Ltd.
InventorsYosuke Tsuchiya, Hiroyuki Tajima, Shota Shimonishi, Akira Sengoku
Life of this patent
Estimating the term…
Abstract
A light-emitting device includes a base material having a conductor layer on a surface thereof, the conductor layer being configured to be connected to an external power source, a light-emitting element mounted on the base, a phosphor layer arranged above the light-emitting element, and a resin layer contacting both of the phosphor layer and the conductor layer and containing heat-conductive particles dispersed therein. The heat-conductive particles have a thermal conductivity of not less than 100 W/m·K and an insulator property or a semiconductor property.
Claims19
A light-emitting device, comprising:
- a base material comprising a conductor layer on a surface thereof, the conductor layer being configured to be connected to an external power source;
- a light-emitting element mounted on the base material;
- a phosphor layer arranged above the light-emitting element;
- and
- a resin layer contacting both of the phosphor layer and the conductor layer and comprising heat-conductive particles dispersed therein so as to decrease a thermal resistance between the phosphor layer and the conductor layer,
- wherein the heat-conductive particles have a thermal conductivity of not less than 100 W/mK and an electrical insulator property or a semiconductor property,
- wherein the resin layer comprises the base material,
- wherein the base material further comprises a recessed portion and white pigment particles, and
- wherein the light-emitting element is mounted on a bottom surface of the recessed portion.
A light-emitting device, comprising:
- a package;
- a lead formed on the package;
- a light-emitting element formed on the package and electrically connected to the lead;
- a sealing member formed in the package on the light-emitting element, the sealing member comprising:
- a lower portion contacting the light-emitting element and comprising a plurality of the heat-conductive particles including a thermal conductivity of not less than 100 W/mK and an electrical insulator property or a semiconductor property;
- and an upper portion formed on and contacting the lower portion and comprising a plurality of phosphor particles, the heat-conductive particles conducting heat generated by the plurality of phosphor particles to the lead for dissipating the heat,
- wherein the package and the sealing member comprise a base material,
- wherein the base material further comprises a recessed portion and white pigment particles, and
- wherein the light-emitting element is mounted on a bottom surface of the recessed portion.
Dependencies are inferred from the claim text.