Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device

A photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein

• the composition comprises an (A) alkali-soluble polyimide resin obtained by reacting a tetracarboxylic acid dianhydride with a diamine containing 10 mol % to 80 mol % of a phenolic hydroxyl group-containing diamine represented by formula (A-1) based on the diamines in total and an aliphatic ether diamine represented by formula (8):
• wherein R1, R2 and R3 are independently alkylene groups having 1 to 10 carbons atoms,
• wherein in the above formulae b is an integer between 2 and 80, and
• a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.