Epoxy resin compositions using solvated solids

An epoxy resin composition comprising:

• an epoxy component and a curing component;
• wherein the epoxy component comprises at least one epoxy resin having two or more 1,2-epoxy groups per molecule, and the epoxy component is present in an amount of about 30% to about 92% by weight of the epoxy resin composition;
• wherein the curing component comprises:
• a reactive primary curing agent comprising at least one polyamine;
• and a secondary curing agent composition;
• wherein the secondary curing agent composition comprises at least one secondary curing agent solvated in a carrier comprising at least one member selected from the group consisting of ethyl alcohol, benzyl alcohol, and a polyether amine, provided that said polyether amine is not present as the at least one polyamine of the reactive primary curing agent when the carrier comprises polyether amine;
• wherein the at least one secondary curing agent comprises at least one imidazole, and the at least one secondary curing agent is present in an amount of about 0.001% to about 5% by weight of the epoxy resin composition;
• wherein the carrier is present in an amount of about 30 to about 99.9% by weight of the secondary curing agent composition;
• and
• wherein the reactive primary curing agent is present in an amount of about 8% to about 70% by weight of the epoxy resin composition, such that the number of reactive group equivalents present in the curing component is from about 0.50 to 0.98 times the number of epoxide group equivalents present in the epoxy component.