Formulation methodology for distortional thermosets
AssigneeThe Boeing Company
InventorsStephen Christensen, Samuel J. Tucker, Jeffrey S. Wiggins
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Abstract
Methods and formulations for distortional thermosets are disclosed that display enhanced composite mechanical performances and robust sorption resistance. The composition includes an epoxy resin of formula (I): and a diamine curing agent. The resultant distortional thermoset compositions possess superior out-life requirements and advantageous reaction kinetics for preparing prepreg compositions and materials.
Claims21
A composition having a von Mises strain of at least 0.300, the composition comprising:
- an epoxy resin of formula (I):
- and
- a diamine curing agent selected from the group consisting of formulas (II)-(XXV):
- and combinations thereof, wherein the diamine curing agent comprises:
- about 10% (wt) of formula (V):
- and
- about 90% (wt) of formula (II):
A composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (wt) after 30 days, the composition comprising:
- an epoxy resin of formula (I):
- and
- a diamine curing agent.
A composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (wt) after 30 days, the composition comprising:
- an epoxy resin of formula (I):
- and
- a diamine curing agent comprising:
- about 10% (wt) of formula (V):
- and
- About 90% (wt) of formula (II):
A composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
- an epoxy resin of formula (I):
- and
- a diamine curing agent selected from the group consisting of formulas (II)-(XXV):
- and combinations thereof.
A resin composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
- an epoxy resin of formula (I):
- a first diamine curing agent, and
- a second diamine curing agent.
A resin composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
- an epoxy resin of formula (I):
- a first diamine curing agent, and
- a second diamine curing agent,
- wherein the ratio of the first diamine curing agent and the second diamine curing agent is about 9:1 (wt %).
A resin composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
- an epoxy resin of formula (I):
- a first diamine curing agent, and
- a second diamine curing agent,
- wherein the first diamine curing agent comprises at least one electron-withdrawing moiety, and
- wherein the ratio of the first diamine curing agent and the second diamine curing agent is about 9:1 (wt %).
A composition having a von Mises strain of at least 0.300 and an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
- an epoxy resin of formula (I):
- and
- a diamine curing agent.
Dependencies are inferred from the claim text.