Producing method of metal fine particles or metal oxide fine particles, metal fine particles or metal oxide fine particles, and metal-containing paste, and metal film or metal oxide film
AssigneeHitachi Metals, Ltd.
InventorsYamato Hayashi, Yoshihiro Sekiguchi, Hirotsugu Takizawa, Dai Ishikawa, Tomiya Abe
Life of this patent
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Abstract
There is provided a producing method of metal fine particles or metal oxide fine particles for producing metal fine particles or metal oxide fine particles by atomizing raw materials by performing processes including an oxidizing process and a reducing process to the raw materials composed of metal or a metal compound.
Claims5
A producing method of metal fine particles, comprising atomizing raw materials composed of copper and producing metal fine particles by repeating a cycle multiple times, the cycle comprising:
- an oxidizing process of producing a metal oxide by oxidizing the raw materials;
- a grinding process of grinding the metal oxide after the oxidizing process;
- and
- a reducing process of reducing the metal oxide in a liquid solvent by
- adding the metal oxide subjected to the grinding process in the liquid solvent,
- dispersing the metal oxide in the liquid solvent by irradiating the liquid solvent with ultrasonic waves, thereafter
- irradiating the liquid solvent with microwaves of 2.45 GHz, to thereby set a temperature of the liquid solvent to 80° C., thereafter
- irradiating the liquid solvent with microwaves of 2.45 GHz for 1 hour.
A producing method of metal fine particles, comprising:
- a first reducing process of adding raw materials composed of CuO in a liquid solvent, and irradiating the liquid solvent with ultrasonic waves to disperse the CuO in the liquid solvent, and thereafter irradiating the liquid solvent with microwaves of 2.45 GHz to set a temperature of the liquid solvent to 70° C., and thereafter irradiating the liquid solvent with microwaves of 2.45 GHz for 1 hour to reduce the CuO in the solvent, to thereby obtain a product of Cu;
- an oxidizing process of oxidizing the product of Cu to obtain a product of a copper oxide;
- a grinding process of grinding the product of copper oxide after the oxidizing process;
- and
- a second reducing process of adding the product of the copper oxide subjected to the grinding process, into a liquid solvent, then irradiating the liquid solvent with ultrasonic waves to disperse the product of the copper oxide in the liquid solvent, and thereafter irradiating the liquid solvent with microwaves of 2.45 GHz to set a temperature of the solvent to 70° C., and thereafter irradiating the liquid solvent with microwaves of 2.45 GHz for 1 hour to reduce the product of the copper oxide in the liquid solvent,
- wherein after the first reducing process is performed, the oxidizing process, the grinding process, and the second reducing process are repeated multiple times, to thereby atomize the raw materials and produce metal fine particles.
Dependencies are inferred from the claim text.