Liquid ejecting head and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorIsamu Togashi
Life of this patent
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Abstract
Provided is a liquid ejecting head which includes a head main body which has liquid ejection surface through which liquid is ejected, a flexible wiring substrate which is connected to the head main body, and a flow-path member having flow path through which liquid is supplied to the head main body. The flow-path member has an opening portion through which the substrate is inserted. The substrate extends to the flow-path member, with respect to the head main body. The substrate is inclined in a direction directed toward a first surface side of both surfaces of the substrate. In an area on a second surface side of both surfaces of the substrate, the flow path has a portion extending along the head main body.
Claims12
A liquid ejecting head comprising:
- a head main body which has liquid ejection surface through which liquid is ejected;
- a flexible wiring substrate which is connected to the head main body;
- and
- a flow-path member having flow path through which liquid is supplied to the head main body,
- wherein the flow-path member has an inclined opening portion through which the flexible wiring substrate is inserted,
- wherein the flexible wiring substrate extends to the flow-path member, with respect to the head main body,
- wherein the flexible wiring substrate is inclined in a direction directed toward a first surface side of both surfaces of the flexible wiring substrate, and
- wherein, in an area on a second surface side of both surfaces of the flexible wiring substrate, the flow path has a portion extending along the liquid ejection surface.
Dependencies are inferred from the claim text.