Method for improving surface quality of spalled substrates
AssigneeInternational Business Machines Corporation
InventorsStephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana
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Abstract
A compliant material is formed between a base substrate and a support structure prior to performing a controlled spalling process. By positioning the compliant material between the base substrate and the support structure, the localized effects of surface perturbations (particles, wafer artifacts, etc.) on spalling mode fracture can be reduced. The method of the present disclosure thus leads to improved surface quality of the spalled material layer and the remaining base substrate. Moreover, the method of the present disclosure can reduce the density of cleaving artifacts.
Claims24
A method for removing a material layer from a base substrate, said method comprising:
- forming a plating seed layer on a surface of a metal-containing adhesion layer, said metal-containing adhesion layer is located atop a first surface of a base substrate;
- forming a stressor layer atop an exposed surface of the plating seed layer;
- depositing a compliant layer directly on a second surface of the base substrate that is opposite to said first surface prior to contacting with an underlying support structure;
- securing the base substrate to said support structure, wherein said compliant layer is interposed between the second surface of the base substrate and the support structure;
- and
- removing a material layer of said base substrate by spalling, wherein said material layer is attached to at least said stressor layer.
A method for removing a material layer from a base substrate, said method comprising:
- forming a plating seed layer on a surface of a metal-containing adhesion layer, said metal-containing adhesion layer is located atop a first surface of a base substrate;
- forming a stressor layer atop an exposed surface of the plating seed layer;
- depositing a compliant layer directly on a second surface of the base substrate that is opposite to said first surface prior to contacting with an underlying support structure;
- securing the base substrate to said support structure, wherein said compliant layer is interposed between the second surface of the base substrate and the support structure;
- forming a handle substrate atop said metal stressor layer;
- and
- removing a material layer of said base substrate by spalling, wherein said material layer is attached to at least said stressor layer, and wherein said spalling comprises pulling or peeling said handle substrate from atop said metal stressor layer.
A method for removing a material layer from a base substrate, said method comprising:
- forming a plating seed layer on a surface of a metal-containing adhesion layer, said metal-containing adhesion layer is located atop a first surface of a base substrate;
- forming a stressor layer atop an exposed surface of the plating seed layer;
- securing a second surface of the base substrate, which is opposite said first surface of the base substrate, to a support structure, wherein a porous compliant layer is formed interposed between the second surface of the base substrate and the support structure, said porous compliant layer comprising an array of openings within a compliant material and having sidewall edges that are vertical coincident to sidewall edges of at least said base substrate;
- and
- removing a material layer of said base substrate by spalling, wherein said material layer is attached to at least said stressor layer.
Dependencies are inferred from the claim text.