Method for producing molds
AssigneeFUJIFILM Corporation
InventorsAkihiko Ohtsu, Akiko Hattori, Katsuhiro Nishimaki
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Abstract
In production of a mold having a deposited film on the surface thereof as a mold release layer, a quartz substrate plasma etched employing an etching gas that includes a sedimentary gas to form a pattern of protrusions and recesses having a desired shape in a structure constituted by the quartz substrate and a mask layer, while a deposited film constituted by sediment of the sedimentary gas is formed along the pattern of protrusions and recesses. The deposited film becomes the mold release layer. Thereby, throughput of mold production is improved in the production of molds having deposited films as mold release layers on the surfaces thereof.
Claims15
A method for producing a nanoimprinting mold having a mold release layer on the surface thereof, comprising:
- forming a mask layer having a desired pattern on a quartz substrate;
- plasma etching the quartz substrate employing an etching gas including a sedimentary gas and using the mask layer as a mask to form a pattern of protrusions and recesses having a desired shape constituted by the quartz substrate and the mask layer and a mold release layer which is a blanket deposited film constituted by sediment of the sedimentary gas, covering the pattern of protrusions and recesses along the pattern of protrusions and recesses, the plasma etching being performed under conditions that recesses are formed at exposure portions of the quartz substrate from the mask layer while forming the blanket deposited film on the recesses of the quartz substrate and the mask layer.
A method for producing a nanoimprinting mold, comprising:
- forming a mask layer having a desired pattern on a quartz substrate;
- etching the quartz substrate using the mask layer as a mask such that a pattern of protrusions and recesses having a desired shape is formed in the quartz substrate;
- and
- plasma ashing the mask layer using an ashing gas including a sedimentary gas to form a mold release layer which is a blanket deposited film constituted by sediment of the sedimentary gas, covering the pattern of protrusions and recesses along the pattern of protrusions and recesses, plasma ashing being executed under conditions that the mask layer is removed while forming the blanket deposited film on the surface of the pattern of protrusions and recesses.
A method for producing a nanoimprinting mold, comprising:
- forming a mask layer having a desired pattern on a quartz substrate;
- plasma etching the quartz substrate employing an etching gas including a first sedimentary gas and using the mask layer as a mask under conditions that recesses are formed at exposure portions of the quartz substrate from the mask layer while forming a deposited film constituted by first sediment of the sedimentary gas on the recesses of the quartz substrate and the mask layer, and such that a pattern of protrusions and recesses having a desired shape constituted by the quartz substrate and the mask layer which is covered with the deposited film formed along the pattern of protrusions and recesses is formed;
- and
- plasma ashing the mask layer using an ashing gas including a second sedimentary gas under conditions that the mask layer is removed while forming a deposited film constituted by sediment of the first and second sedimentary gases on the surface of the pattern of protrusions and recesses, and such that the pattern of protrusions and recesses is covered with the deposited film formed along the pattern of protrusions and recesses, which functions as a mold release layer.
Dependencies are inferred from the claim text.