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US 9,308,604 B1Granted
Anti-tin whisker solder and method of manufacture thereof
AssigneeLockheed Martin Corporation
InventorsGregory T. Daly, Gary H. Yan
Life of this patent
Estimating the term…
Abstract
A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.
Claims11
A method for preventing tin whiskers in a lead-free solder, the method comprising the steps of:
- providing a first amount of lead-free tin solder;
- and
- mixing a second amount of polyhedral oligomeric silsesquioxane with the first amount of lead-free tin solder,
- wherein the first and second amounts are selected to provide a resulting composition containing about 90% to about 99% by weight of the lead-free tin solder based on the total weight of the resulting composition and about 1% to about 10% by weight of the polyhedral oligomeric silsesquioxane based on the total weight of the resulting composition, and
- wherein the polyhedral oligomeric silsesquioxane contains at least one mercaptopropyl group.
2 more elements
A method for preventing tin whiskers in a lead-free solder, the method comprising the steps of:
- providing a lead-free tin solder base;
- and
- adding a polyhedral oligomeric silsesquioxane containing a thiol functional group to the lead-free tin solder base, the thiol group forming covalent bonds with the tin element of the lead-free tin solder, reducing the number of sites for potential tin whisker growth,
- wherein the polyhedral oligomeric silsesquioxane contains at least one mercaptopropyl group.
1 more element
Dependencies are inferred from the claim text.