Heat-transfer structure
AssigneeAlcatel Lucent
InventorsRoger Scott Kempers, Shankar Krishnan, Alan Michael Lyons, Todd Richard Salamon
Life of this patent
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Abstract
An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.
Claims12
An apparatus, comprising:
- a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface;
- an array of metallic raised features located directly on each of the front and back surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force and wherein the one or more surface singularities are configured as caldera.
An apparatus, comprising:
- a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface;
- an array of metallic raised features located directly on each of the front and back surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force and wherein the metallic raised features include a first cone-shaped portion and a second inverted cone-shaped portion and the surface singularity is located at a connection point between the first cone-shaped portion and the second inverted cone-shaped portion.
An apparatus, comprising:
- a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface;
- an array of metallic raised features located directly on each of the front and back surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force and wherein the metallic raised features include a plurality of merged cone-shaped features and the surface singularities are located at discontinuous merger points between adjacent one of the merged cone-shaped features.
An apparatus, comprising:
- a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface;
- an array of metallic raised features located directly on each of the front and back surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force and wherein the surface singularities are located at cross-cut points in the length of the metallic raised feature.
Dependencies are inferred from the claim text.