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US 9,299,915 B2Granted
Methods and apparatus for magnetic sensor having non-conductive die paddle
AssigneeAllegro MicroSystems, LLC
InventorsShaun D. Milano, Michael C. Doogue, William P. Taylor
Life of this patent
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Abstract
Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.
Claims11
A device, comprising:
- a conductive leadframe;
- a non-conductive die paddle positioned in relation to the leadframe, wherein the die paddle comprises a plastic material;
- a die disposed on the die paddle;
- a magnetic transducer coupled to the die, wherein the magnetic transducer does not overlap with any portion of the conductive leadframe and does overlap with the non-conductive die paddle;
- and
- at least one electrical connection from the die to the leadframe.
3 more elements
A device, comprising:
- a conductive leadframe;
- a non-conductive die paddle positioned in relation to the leadframe;
- a die disposed on the die paddle;
- and
- a magnetic transducer coupled to the die, wherein a cross section of the device through the magnetic transducer consists of non-conductive materials.
2 more elements
A device, comprising:
- a conductive leadframe;
- a non-conductive die paddle positioned in relation to the leadframe, wherein the die paddle comprises a plastic material;
- a die disposed on the die paddle;
- a magnetic transducer coupled to the die, wherein the magnetic transducer does not overlap with any conductive material;
- and
- at least one electrical connection from the die to the leadframe.
3 more elements
A device, comprising:
- a conductive leadframe;
- a means for reducing eddy currents positioned in relation to the leadframe, the means for reducing eddy currents comprising a non-conductive material;
- a die disposed on the means for reducing eddy currents;
- and
- a magnetic transducer coupled to the die, wherein the magnetic transducer does not overlap with any non-conductive materials.
2 more elements
Dependencies are inferred from the claim text.