Olefin resin composition
AssigneeLG Chem, Ltd.
InventorsSungHo Choi, Choong Hoon Lee, JiYoon Woo, HyoJu Kim, Jin Sam Gong
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Abstract
Provided is an olefin resin composition, and a method of manufacturing an encapsulant for an optoelectronic device, in which the encapsulant exhibits excellent adhesive strength with a back sheet and a front substrate included in various optoelectronic devices. In addition, the encapsulant does not have a bad influence on parts such as optoelectronic units or wiring electrodes encapsulated in an optoelectronic device, and a working environment, and can excellently maintain workability and economic feasibility of device manufacturing.
Claims14
An olefin resin composition comprising an olefin resin, an unsaturated silane compound, an amino silane compound, and a radical initiator, wherein the amino silane compound is included in an amount of 1 to 40 parts by weight with respect to 100 parts by weight of the silane compound in the whole olefin resin composition.
Dependencies are inferred from the claim text.