Metal injection molded heat dissipation device
AssigneeIntel Corporation
InventorsGavin D. Stanley, Michael T. Crocker
Life of this patent
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Abstract
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.
Claims12
A base plate for dissipating heat, wherein the base plate is coupled with micro-fins and is a metal injection molded plate, and the base plate is coupled with an integrated heat spreader, wherein the integrated heat spreader and the micro fins dissipate heat from the microelectronic package.
A microelectronic package, comprising
- a base plate coupled with micro-fins, wherein the base plate is a metal injection molded plate;
- and
- an integrated heat spreader, wherein the integrated heat spreader is coupled to the base plate and the micro fins dissipate heat from the microelectronic package.
A method of forming a base plate, comprising:
- a metal injection molded plate,
- wherein the metal injection molded plate employs a plurality of micro fins to dissipate heat.
Dependencies are inferred from the claim text.