Wiring board and manufacturing method thereof
AssigneeRicoh Company, Ltd.
InventorsHiroshi Miura, Koei Suzuki, Atsushi Onodera, Takanori Tano
Life of this patent
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Abstract
A wiring board includes a variable wettability layer situated on a top surface of a support board and containing a material of which a critical surface tension changes by energy given thereto. A conductive layer is situated inside a concave portion formed in the variable wettability layer. The concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between the side walls is reduced toward a bottom of the concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of the conductive layer. Upper edges of the side walls are formed in gently curved surfaces.
Claims10
A wiring board comprising:
- a support board;
- a variable wettability layer situated on a top surface of the support board and containing a material having a critical surface tension that changes by energy given thereto;
- and
- a conductive layer situated inside a concave portion formed in the variable wettability layer,
- wherein said concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between said side walls is reduced toward a bottom of said concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of said conductive layer, and upper edges of said side walls are formed in smooth curved surfaces.
A manufacturing method of a wiring board, comprising:
- forming a variable wettability layer on a support board, the variable wettability layer containing a material of which a critical surface tension changes by energy given thereto;
- forming a concave portion in said variable wettability layer by a laser abrasion method, said concave portion having opposite side walls formed in tapered surfaces inclining so that a distance between said side walls is reduced toward a bottom of said concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of said conductive layer, and upper edges of said side walls being formed in gently curved surfaces;
- and
- forming a conductive layer in said concave portion by applying conductive ink inside said concave portion.
Dependencies are inferred from the claim text.