Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component

A method for manufacturing a substrate with a built-in electronic component, comprising:

• forming a first conductor wiring layer on a first resin insulating layer such that the first conductor wiring layer includes a first conductor pad and a support conductor wiring layer configured to position an electronic component;
• laminating a second resin insulating layer on the first resin insulating layer and the first conductor wiring layer;
• forming a first via conductor through the second resin insulating layer such that the first via conductor reaches the first conductor pad;
• forming a second conductor wiring layer on the second resin insulating layer such that the second conductor wiring layer includes a second conductor pad connected to the first via conductor on the second resin insulating layer;
• laminating a third resin insulating layer on the second resin insulating layer and the second conductor wiring layer;
• irradiating laser upon the third resin insulating layer such that a cavity is formed through the third resin insulating layer and the second resin insulating layer and exposes a portion of the support conductor wiring layer;
• positioning the electronic component on the portion of the support conductor wiring layer in the cavity;
• laminating a fourth resin insulating layer on the third resin insulating layer and the electronic component;
• forming a second via opening through the third resin insulating layer and the fourth resin insulating layer such that the second via opening reaches the second conductor pad;
• forming a third via opening through the fourth resin insulating layer such that the third via opening reaches a terminal of the electronic component;
• and
• plating the second via opening and the third via opening such that a second via conductor comprising filled plating is formed in the second via opening and a third via conductor comprising filled plating is formed in the third via opening.