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US 9,288,903 B2Granted
Printed circuit board and method of manufacturing the same
AssigneeNitto Denko Corporation
InventorsMineyoshi Hasegawa, Keisuke Okumura, Shinichi Inoue, Hiroyuki Hanazono
Life of this patent
Estimating the term…
Abstract
A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 μm and not more than 1.0 μm.
Claims12
A method of manufacturing a printed circuit board comprising the steps of:
- preparing an insulating layer consisting essentially of a porous polytetrafluoroethylene having continuous pores, an average pore size of the continuous pores of said polytetrafluoroethylene being not more than 0.1 μm;
- and
- forming a conductor pattern having a given pattern on said insulating layer using a processing solution such that the processing solution is prevented from entering or remaining in the continuous pores of said insulating layer.
Dependencies are inferred from the claim text.