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US 9,288,902 B2Granted
Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsEun Sil Kim, Sung Han Kim, Sa Yong Lee, Jin Ho Hong, Yong Il Kwon, Sang Hyun Shin, Keun Yong Lee
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Abstract
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.
Claims5
A printed circuit board comprising:
- a light-blocking glass substrate;
- a negative photosensitive insulating layer formed on the glass substrate;
- and
- a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer,
- wherein the negative photosensitive insulating layer is formed on either side of the glass substrate.
2 more elements
Dependencies are inferred from the claim text.