Thin-film multi-layer micro-wire structure

A thin-film multi-layer micro-wire structure, comprising:

• a substrate having a substrate surface;
• a layer located on the substrate surface or forming a part of the substrate, the layer having a layer surface and one or more micro-channels in the layer, each micro-channel having a width less than or equal to 20 microns;
• a cured electrically conductive micro-wire located only within each of the one or more micro-channels, the cured electrically conductive micro-wire having a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight;
• an electrolessly plated layer located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire, the electrolessly plated layer having a thickness less than a thickness of the micro-wire so that the micro-wire and electrolessly plated layer form a thin-film multi-layer micro-wire;
• and
• a cured material in each micro-channel in contact with the plated layer on a side of the plated layer opposite the micro-wire.