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US 9,288,900 B2Granted
Printed circuit board, display device and method of manufacturing printed circuit board
AssigneeSamsung Display Co., Ltd.
InventorsYou Bean Kim, Seock-Hwan Kang, Jong Seo Lee
Life of this patent
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Abstract
A printed circuit board includes an insulation layer adjacent to a high-speed signal wire layer. A low-loss material layer is provided between the high-speed signal wire layer and the insulation layer. As a result, it is possible to reduce frequency loss of a high-speed signal wire layer and improve reliability of the printed circuit board.
Claims17
A printed circuit board, comprising:
- a plurality of signal wire layers comprising a first high-speed signal wire layer and a first low-speed signal wire layer, wherein the first high-speed signal wire layer is connected to a source of signals of a data speed of 3.0 Gbps or higher whereas the first low-speed signal wire layer is not connected to a source of signals of a data speed of 3.0 Gbps or higher;
- a plurality of high-loss insulation layers made of a high-loss insulation material;
- and
- a plurality of low-loss insulation layers made of a low-loss insulation,
- wherein a frequency-dependent loss of the high-loss insulation material greater than that of the low-loss insulation material,
- wherein the first high-speed signal wire layer, a first one of the plurality of low-loss insulation layers, a first one of the plurality of high-loss insulation layers and the first low-speed signal wire layer are laminated in order such that the first low-loss insulation layer contacts the first high-speed signal wire layer and that the first high-loss insulation layer contacts the first low-speed signal wire layer.
3 more elements
A method of manufacturing a printed circuit board, comprising:
- forming signal wire layers comprising a first high-speed signal wire layer and a first low-speed signal wire layer, wherein the first high-speed signal wire layer is connected to a source of signals of a data speed of 3.0 Gbps or higher whereas the first low-speed signal wire layer is not connected to a source of signals of a data speed of 3.0 Gbps or higher;
- forming a plurality of high-loss insulation layers made of a high-loss insulation material and comprising a first high-loss insulation layer;
- forming a plurality of low-loss insulation layers made of a low-loss insulation material and comprising a first low-loss insulation layer,
- wherein a frequency-dependent loss of the high-loss insulation material greater than that of the low-loss insulation material,
- wherein the first high-speed signal wire layer, the first low-loss insulation layer, the first high-loss insulation layer and the first low-speed signal wire layer are laminated in order such that the first low-loss insulation layer contacts the first high-speed signal wire layer and that the first high-loss insulation layer contacts the first low-speed signal wire layer.
2 more elements
Dependencies are inferred from the claim text.