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US 9,288,899 B2Granted
Micro device transfer head array
AssigneeLuxVue Technology Corporation
InventorsDariusz Golda, Andreas Bibl
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Abstract
A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.
Claims20
A transfer head array comprising:
- a base substrate;
- an insulating layer on the base substrate;
- a patterned device layer on the insulting layer, the patterned device layer comprising a trace interconnect integrally formed with an array of electrodes, wherein each electrode includes a mesa structure protruding above the trace interconnect;
- and
- a dielectric layer covering a top surface of each mesa structure.
2 more elements
Dependencies are inferred from the claim text.