Environmental sensitive electronic device package

An environmental sensitive electronic device package comprising:

• a first substrate having at least one predetermined flexure area;
• a second substrate located above the first substrate;
• an environmental sensitive electronic device located on the first substrate and between the first substrate and the second substrate;
• at least one side wall barrier structure located between the first substrate and the second substrate, wherein the at least one side wall barrier structure surrounds the environmental sensitive electronic device and has at least one flexure stress dispersing structure, and the at least one flexure stress dispersing structure is located in the at least one predetermined flexure area, wherein all of the at least one side wall barrier structure and all of the at least one flexure stress dispersing structure are made of the same material, and a pattern of the at least one side wall barrier structure located outside of the at least one predetermined flexure area is different to a pattern of the at least one flexure stress dispersing structure located in the at least one predetermined flexure area, the number of the at least one side wall barrier structure located at one side of the first substrate is plural, and the number of the at least one flexure stress dispersing structure is plural;
• and
• a filler layer located between the first substrate and the second substrate, the filler layer covering the at least one side wall barrier structure and the environmental sensitive electronic device.