Transversely actuated piezoelectric bellows heatsink

A circuit board comprising:

• a power supply;
• at least one electronic component mounted on the circuit board;
• a transversely actuated piezoelectric bellows heatsink (TAPBH) mounted on the circuit board, wherein the TAPBH comprises:
• a linkage, wherein the linkage comprises a plurality of rigid sections coupled by flexible joints;
• a first end of the linkage affixed to a first fixed support;
• a piezoelectric element mechanically coupled to a second end of the linkage;
• a diaphragm mechanically affixed to a first side of the linkage;
• and
• an air enclosure having an open area affixed to the diaphragm;
• and
• a second fixed support affixed to a second side of the linkage, wherein cyclic power from the power supply causes the piezoelectric element to expand and contract to force the linkage to expand and contract in an analogous manner, thus causing the diaphragm to move in an amplified motion to cause air to enter and be expelled from the air enclosure via air valves, thereby forcing cool air to be blown across said at least one electronic component.

A computer system comprising:

• a power supply;
• a circuit board comprising:
• at least one electronic component mounted on the circuit board;
• a transversely actuated piezoelectric bellows heatsink (TAPBH) mounted on the circuit board, wherein the TAPBH comprises:
• a linkage, wherein the linkage comprises a plurality of rigid sections coupled by flexible joints;
• a first end of the linkage affixed to a first fixed support;
• a piezoelectric element mechanically coupled to a second end of the linkage;
• a diaphragm mechanically affixed to a first side of the linkage;
• and
• an air enclosure having an open area affixed to the diaphragm;
• and
• a second fixed support mechanically affixed to a second side of the linkage, wherein cyclic power from the power supply causes the piezoelectric element to expand and contract to force the linkage to expand and contract in an analogous manner, thus causing the diaphragm to move in an amplified motion to cause air to enter and be expelled from the air enclosure via air valves, thereby forcing cool air to be blown across said at least one electronic component.