Conductive element and method of manufacturing the same, wiring element, and master copy

A wiring element comprising:

• a substrate;
• a shape layer which is provided on a surface of the substrate and has a first wavy surface, a second wavy surface, and a third wavy surface;
• a first layer provided on the first wavy surface;
• and
• a second layer provided on the second wavy surface,
• wherein the shape layer contains an energy ray-curable resin composition,
• the first layer has a laminated structure in which two or more layers are laminated,
• the second layer has a single-layered structure or a laminated structure including a partial layer of the first layer,
• the first and second layers form a conductive pattern portion, and
• the first, second, and third wavy surfaces satisfy the following relationship:
• 0≦(Am1/λm1)<(Am2/λm2)<(Am3/λm3)≦1.8
• (where Am1 is an average width of vibrations of the first wavy surface, Am2 is an average width of vibrations of the second wavy surface, Am3 is an average width of vibrations of the third wavy surface, λm1 is an average wavelength of the first wavy surface, λm2 is an average wavelength of the second wavy surface, and λm3 is an average wavelength of the third wavy surface).

A method of manufacturing a conductive element comprising:

• applying an energy ray-curable resin composition to a surface of a substrate;
• while a rotation surface of a rotation master copy is rotated and is brought into close contact with the energy ray-curable resin composition applied to the surface of the substrate, irradiating the energy ray-curable resin composition with energy rays emitted by an energy ray source provided in the rotation master copy via the rotation surface so as to be cured, thereby forming a shape layer having a first wavy surface, a second wavy surface, and a third wavy surface on the surface of the substrate;
• forming a laminated film on the first, second, and third wavy surfaces;
• and
• removing the laminated film formed on the third wavy surface among the first, second, and third wavy surfaces, allowing the laminated film formed on the first wavy surface to remain as a first layer, and allowing a partial layer of the laminated film formed on the second wavy surface to remain as a second layer, thereby forming a conductive pattern portion, wherein the first, second, and third wavy surfaces satisfy the following relationship:
• 0≦(Am1/λm1)<(Am2/λm2)<(Am3/λm3)≦1.8
• (where Am1 is an average width of vibrations of the first wavy surface, Am2 is an average width of vibrations of the second wavy surface, Am3 is an average width of vibrations of the third wavy surface, λm1 is an average wavelength of the first wavy surface, λm2 is an average wavelength of the second wavy surface, and λm3 is an average wavelength of the third wavy surface).