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US 9,287,831 B2Granted
Temperature stabilized circuitry
AssigneeAnalog Devices Global
InventorDzianis Lukashevich
Life of this patent
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Abstract
This disclosure relates to temperature stabilization of at least a portion of an amplifier, such as a logarithmic amplifier, and/or a band gap reference circuit. In one aspect, one or more stages of an amplifier, a heater, and a temperature sensor are included in a semiconductor material and surrounded by thermally insulating sidewalls.
Claims24
An integrated circuit, comprising:
- temperature stabilized circuitry;
- a temperature sensor configured to gather an indication of temperature associated with the temperature stabilized circuitry;
- a heater configured to heat the temperature stabilized circuitry based on the indication of temperature;
- and
- other circuit elements that are different from the temperature stabilized circuitry, the temperature sensor, and the heater;
- wherein the other circuit elements, the temperature stabilized circuitry, the temperature sensor, and the heater are included on the same integrated circuit;
- wherein the other circuit elements comprise at least one of:
- control circuitry;
- power management circuitry;
- or
- a current mirror;
- and
- wherein the temperature sensor, the heater, and the temperature stabilized circuitry are thermally isolated from the other circuit elements.
10 more elements
An apparatus comprising:
- at least a portion of an amplifier in a semiconductor material;
- a temperature sensor configured to gather an indication of temperature in the semiconductor material;
- a heater in the semiconductor material and configured to heat the portion of the amplifier based on the indication of temperature;
- and
- at least one thermally insulating sidewall configured to thermally isolate the portion of the amplifier, the temperature sensor, and the heater on one side of the thermally insulating sidewall from other circuit elements on an opposing side of the thermally insulating sidewall, wherein the portion of the amplifier and the circuit elements are included on the same integrated circuit.
2 more elements
A method of heating at least a portion of an amplifier, the method comprising:
- sensing a temperature associated with at least a portion of an amplifier, wherein the portion of the amplifier is in a semiconductor-on-insulator (SOI) material over an insulating layer and surrounded by insulating sidewalls;
- and
- heating the portion of the amplifier with a heater responsive to said sensing to maintain the portion of the amplifier at a selected operating temperature, wherein the heater is in the SOI material, and wherein the selected operating temperature is higher than an ambient temperature.
Dependencies are inferred from the claim text.