Light emitting diode package
AssigneeSeoul Semiconductor Co., Ltd.
InventorJae Hyun Park
Life of this patent
Estimating the term…
Abstract
An embodiment of the invention provides a light emitting diode package. The light emitting diode package includes at least three light emitting diode chips; first leads comprising at least three chip mounting sections on which the at least three light emitting diode chips are mounted, respectively; second leads separated from the first leads and connected to the light emitting diode chips via wires, respectively; and a substrate having the first leads and the second leads formed thereon, wherein the at least three chip mounting sections are arranged around a center of the substrate through which an optical axis of the light emitting diode package passes.
Claims20
A light-emitting diode package, comprising:
- first, second, and third light-emitting diode chips;
- first leads comprising first, second, and third chip mounting sections on which the first, second, and third light-emitting diode chips are disposed, respectively;
- second leads separated from the first leads and connected to the first, second, and third light-emitting diode chips via wires, respectively;
- and
- a substrate comprising:
- the first leads and the second leads disposed on a first surface of the substrate;
- a first insulating plate comprising a filling recess;
- a heat sink disposed only in the filling recess of the first insulating plate;
- and
- a second insulating plate disposed on the first insulating plate and covering the filling recess and the heat sink,
- wherein the first, second, and third chip mounting sections are disposed around a center of the substrate through which an optical axis of the light-emitting diode package passes.
A light-emitting diode package, comprising:
- first, second, third, and fourth light-emitting diode chips comprising a white chip, a blue chip, a green chip, and a red chip, respectively;
- first leads and second leads configured to allow individual operation of the first, second, third, and fourth light-emitting diode chips;
- a substrate comprising:
- the first leads and the second leads disposed on a first surface of the substrate;
- a first insulating plate comprising a filling recess;
- a heat sink disposed only in the filling recess of the first insulating plate;
- a second insulating plate disposed on the first insulating plate and covering the filling recess and the heat sink;
- and
- a light transmitting encapsulation part disposed on the substrate and comprising a lens section covering the first, second, third, and fourth light-emitting diode chips,
- wherein one of the blue chip, the green chip, and the red chip is disposed near the white chip in a diagonal direction.
Dependencies are inferred from the claim text.