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US 9,287,479 B2Granted
Luminous devices, packages and systems containing the same, and fabricating methods thereof
AssigneeSamsung Electronics Co., Ltd.
InventorYu-Sik Kim
Life of this patent
Estimating the term…
Abstract
The present invention is directed to a vertical-type luminous device and high throughput methods of manufacturing the luminous device. These luminous devices can be utilized in a variety of luminous packages, which can be placed in luminous systems. The luminous devices are designed to maximize light emitting efficiency and/or thermal dissipation. Other improvements include an embedded zener diode to protect against harmful reverse bias voltages.
Claims9
A light emitting device, comprising:
- a supporting member having a first conductive member and a second conductive member, wherein each of the first conductive member and the second conductive member extends from a first surface of the supporting member to a second surface of the supporting member opposite the first surface;
- and
- a luminous structure connected onto the first surface of the supporting member, the luminous structure having a first cladding layer, an active layer and a second cladding layer, and an insulated through-via contact connected to the first conductive member.
Dependencies are inferred from the claim text.