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US 9,287,478 B2Granted
Method and apparatus for accurate die-to-wafer bonding
AssigneeEpistar Corporation
InventorsChyi Shyuan Chern, Hsin-Hsien Wu, Chih-Kuang Yu, Hung-Yi Kuo
Life of this patent
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Abstract
A plurality of conductive pads are disposed on a substrate. A plurality of semiconductor dies are each disposed on a respective one of the conductive pads. A mold device is positioned over the substrate. The mold device contains a plurality of recesses that are each configured to accommodate a respective one of the semiconductor dies underneath.
Claims20
A system, comprising:
- a substrate having a plurality of conductive pads disposed thereon;
- a plurality of semiconductor dies that are each disposed on a respective one of the conductive pads;
- and
- a mold device positioned over the substrate, wherein the mold device contains a plurality of recesses that are each configured to accommodate a respective one of the semiconductor dies underneath, and wherein the recesses and the semiconductor dies have non-identical shapes such that sidewalls of the recesses would block movements of the semiconductor dies during a bonding or reflow process.
1 more element
A system, comprising:
- a substrate having a plurality of bonding pads disposed thereon;
- a plurality of photonic devices disposed on the plurality of bonding pads, respectively;
- and
- a mold fixture having a plurality of concave openings, wherein each photonic device is secured by a respective one of the concave openings in a manner such that a lateral shift between each photonic device and the respective bonding pad therebelow is less than a predefined value, and wherein the concave openings and the photonic devices have different geometrical dimensions such that sidewalls of the concave openings would block movement of the photonic dies during a bonding or reflow process.
1 more element
A system, comprising:
- a sub-mount having a plurality of bonding pads disposed thereon;
- plurality of LED dies that are each coupled to a respective one of the bonding pads through a reflow-able material, wherein each LED die has a smaller dimension in a top view than the respective bonding pad coupled thereto;
- and
- a mold apparatus that includes a plurality of concave recesses, wherein the mold apparatus is attached to the sub-mount in a manner such that each LED die is housed in a respective one of the recesses, and wherein a positional shift of each LED die is restricted by the respective recess, and wherein the concave recesses have geometrically different shapes or sizes than the LED dies housed therein such that sidewalls of the concave recesses would block movement of the LED dies during a bonding or reflow process.
1 more element
Dependencies are inferred from the claim text.