Light emitting diode package
AssigneeSeoul Semiconductor Co., Ltd.
InventorsJae Jin Lee, Sung Ho Choi, Duk In Kang
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Abstract
An LED package includes a lead frame, a housing part, and a lead heat dissipating part. The lead frame includes a first lead mounting an LED chip and a second lead spaced apart from the first lead. The housing part covers a portion of the lead frame and includes an opening part for exposing the LED chip, a first side corresponding to a support side contacting the first lead and the second lead, and a second side opposite to the first side. The lead heat dissipating part is extended from the first lead and exposed partially to the first side of the housing part. Herein, the first side of the housing part is thicker than the second side.
Claims29
A light emitting diode (LED) package comprising:
- a lead frame comprising a first lead and a second lead spaced apart from the first lead;
- an LED chip disposed on the first lead;
- a housing covering a portion of the lead frame and comprising an opening exposing the LED chip, a support side contacting the first lead and the second lead, and an opposite side that is opposite to the support side;
- and
- a lead heat dissipating part extended from the first lead and partially exposed from the support side of the housing,
- wherein the support side of the housing is thicker than the opposite side.
Dependencies are inferred from the claim text.