Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

A light emitting device having a resin package,

• wherein a resin part and at least one lead are formed in a substantially same plane in an outer side surface,
• wherein at least one surface of a bottom surface and an upper surface of the at least one lead is plated and the outer side surface of the at least one lead is not plated,
• wherein the resin part has a “T” shape at least at two side surfaces of the resin package, and
• wherein the at least one lead has exposed portions located at four corners of the resin package, the exposed portions being separated from each other by the resin part at four side surfaces of the resin package.

A method of manufacturing a resin package in which a resin part and a lead are formed in a substantially same plane in an outer side surface, the method comprising:

• sandwiching a lead frame provided with a notch part, between an upper mold and a lower mold;
• transfer-molding a thermosetting resin containing a light reflecting material in a space located between the upper mold and the lower mold such that the thermosetting resin fills the notch part, to form a resin-molded body in the lead frame, a portion of the resin molded body being located in the notch part;
• and
• cutting the resin-molded body and the lead frame along the notch part,
• wherein the lead frame is plated before being sandwiched by the upper mold and the lower mold.

A method of manufacturing a light emitting device having a resin package in which a resin part and a lead are formed in a substantially same plane in an outer side surface, the method comprising:

• sandwiching a lead frame provided with a notch part, between an upper mold and a lower mold;
• transfer-molding a thermosetting resin in a space located between the upper mold and the lower mold such that the thermosetting resin fills the notch part, to form a resin-molded body in the lead frame, a portion of the resin molded body being located in the notch part;
• wherein the notch part is configured such that the resin-molded body and the lead frame are cuttable at the notch part, and
• wherein the lead frame is plated before being sandwiched between the upper mold and the lower mold.