Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
AssigneeNitto Denko Corporation
InventorsHidenori Onishi, Shinya Ota, Kazuhiro Fuke
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Abstract
The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.
Claims4
An epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector,
- the epoxy resin composition comprising the following ingredients (A) to (F):
- (A) an epoxy resin having an isocyanuric ring structure;
- (B) an acid anhydride curing agent;
- (C) a titanium oxide white pigment;
- (D) a silica powder filler;
- (E) a release agent;
- and
- (F) a curing accelerator;
- wherein the total content of the titanium oxide white pigment (C) and the silica powder filler (D) is from 75 to 94% by weight, based on the weight of the epoxy resin composition;
- wherein the release agent (E) is represented by the following structural formula (1):
- CH3—(CH2)k—CH2—O—(CHRm-CHRn-O)x—H (1)
- in which each of Rm and Rn represents a hydrogen atom;
- k and x are 48 and 20 respectively or 28 and 5 respectively;
- and
- wherein the release agent (E) is present in an amount of from 0.2 to 0.6% by weight, based on the weight of the epoxy resin composition.
Dependencies are inferred from the claim text.