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US 9,287,468 B2Granted
LED submount with integrated interconnects
AssigneeGlo AB
InventorsScott Brad Herner, Linda Romano, Daniel Bryce Thompson, Martin Schubert
Life of this patent
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Abstract
A submount for light emitting diode (LED) die includes a substrate containing a plurality of tubs configured to receive an LED die, and a plurality of integrated interconnects integrated into the substrate. At least a portion of the interconnects for each tub have an exposed portion on a side of the submount and at least some of the plurality of the interconnects are not connected to other interconnects in the submount.
Claims10
A submount for light emitting diode (LED) die, comprising:
- a substrate comprising a plurality of tubs configured to receive an LED die;
- and
- a plurality of integrated interconnects integrated into the substrate,
- wherein at least a portion of the interconnects for each tub have an exposed portion on a side of the submount and at least some of the plurality of the interconnects are not connected to other interconnects in the submount.
1 more element
Dependencies are inferred from the claim text.