LED die and method of manufacturing the same
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsChing-Hsueh Chiu, Ya-Wen Lin, Po-Min Tu, Shih-Cheng Huang
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Abstract
An LED die includes a substrate, a first buffer layer, a second buffer layer, a plurality of nanospheres, a first semiconductor layer, an active layer and a second semiconductor layer. The first buffer layer, the second buffer layer, the first semiconductor layer, the active layer and the second semiconductor layer are formed successively on the substrate. The substrate has a plurality of protrusions on a surface thereof. The nanospheres are located on the protrusions and covered by the second buffer layer and located in the second buffer layer. The present disclosure also provides a method of manufacturing an LED die.
Claims13
A method of manufacturing an LED die comprising:
- forming a first buffer layer on a surface of a substrate with a plurality of protrusions formed on the surface thereof;
- forming a second buffer layer on the first buffer layer, the second buffer layer covering the first buffer layer;
- etching the first buffer layer and the second buffer layer upon the protrusions to form a plurality of first holes;
- etching the second buffer layer between the protrusions to form a plurality of second holes;
- filling the first holes and the second holes with a plurality of nanospheres;
- continuing to grow the second buffer layer to cover the nanospheres;
- and
- forming a first semiconductor layer, an active layer and a second semiconductor layer on the second buffer layer successively.
Dependencies are inferred from the claim text.