Semiconductor chip package and method for manufacturing thereof

A method for manufacturing a semiconductor chip package, comprising:

• providing a substrate, wherein the substrate is defined into a plurality of semiconductor chip area, each semiconductor chip area has at least one semiconductor chip, the semiconductor chip has a sensor device and at least one connecting pad structure, wherein the sensor device is disposed on an upper surface of the semiconductor chip, and the connecting pad structure is electrically connected to the sensor device, a first adhesive layer is disposed on the sensor device and the upper surface of the semiconductor chip, and a carrier substrate is disposed on the first adhesive layer;
• forming a plurality of vias in the semiconductor chip, the vias extending from a lower surface of the semiconductor chip to the upper surface of the semiconductor chip, wherein the plurality of vias comprises:
• at least one first via contacting the connecting pad structure and exposing a part of the connecting pad structure;
• and
• at least one second via without contacting the connecting pad structure, wherein a depth of the first via extending from the lower surface to the upper surface is substantially the same with a depth of the second via extending from the lower surface to the upper surface;
• and
• forming a redistribution layer below the lower surface of the semiconductor chip, the redistribution layer extending from the lower surface to the upper surface of the semiconductor chip, a part of the redistribution layer disposed in the vias, wherein the redistribution layer in the first via is electrically connected to the sensor device through the connecting pad structure, and the redistribution layer in the second via contacts sidewalls of the second via.

A method for manufacturing a semiconductor chip package, comprising:

• providing a substrate, wherein the substrate is defined into a plurality of semiconductor chip area, each semiconductor chip area has at least one semiconductor chip, the semiconductor chip has a sensor device and at least one connecting pad structure, wherein the sensor device is disposed on an upper surface of the semiconductor chip, and the connecting pad structure is electrically connected to the sensor device, a first adhesive layer is disposed on the sensor device and the upper surface of the semiconductor chip, and a carrier substrate is disposed on the first adhesive layer;
• forming a plurality of vias in the semiconductor chip, the vias extending from a lower surface of the semiconductor chip to the upper surface of the semiconductor chip, wherein the plurality of vias comprises:
• at least one first via contacting the connecting pad structure and exposing a part of the connecting pad structure;
• and
• at least one second via without contacting the connecting pad structure;
• forming a redistribution layer below the lower surface of the semiconductor chip, the redistribution layer extending from the lower surface to the upper surface of the semiconductor chip, a part of the redistribution layer disposed in the vias, wherein the redistribution layer in the first via is electrically connected to the sensor device through the connecting pad structure;
• precutting along a plurality of scribe lines between the semiconductor chip areas from the lower surface to the upper surface;
• forming a plurality of conductive external connections below the lower surface of the semiconductor chip, and the conductive external connections electrically connected to the redistribution layer;
• cutting along the plurality of scribe lines to remove partial first adhesive layer along the plurality of scribe lines and separate each of the semiconductor chips, but each of the semiconductor chips still attached below the carrier substrate;
• attaching a film frame carrier to connect the conductive external connections, and removing the carrier substrate on the semiconductor chips;
• and
• attaching a second adhesive layer on the first adhesive layer, and removing the film frame carrier.